Electroplated phase change switch

ABSTRACT

The present disclosure generally relates to a structure, system, and method for manufacturing an electrical component for a memory device. For example, depositing alternating layers of conductive and insulator materials over an etch stop layer to create a vertical stack, etching a trench through the vertical stack to expose the etch stop layer, electroplating the conductive layers using a plating material based on a desired electrical behavior, and forming a connection between the plating materials for each of the conductive layers.

BACKGROUND OF THE DISCLOSURE

Field of the Disclosure

Embodiments of the present disclosure generally relate to an electronic device, and more specifically, to a 3D array of electroplated phase change or ovonic threshold switches (OTS).

Description of the Related Art

Phase change memory (PCM) is a type of non-volatile memory technology. PCM is an emerging technology and a candidate for storage class memory (SCM) applications and a serious contender to dislodge NOR and NAND flash memory in solid state storage applications and, in the case of NAND flash, solid-state drives (SSDs). PCM functions based upon switching a memory cell, typically based on chalcogenides such as Ge₂Sb₂Te₅, between two stable states, a crystalline state and an amorphous state, by heating the memory cell. To heat the memory cell, an electrical current flows through the PCM cell.

An array of PCM cells arranged in an array, and each PCM cell may be coupled with a selecting switch such as an ovonic threshold switch (OTS). Word lines (WL) and bitlines (BL) are arranged so that each memory cell can be programmed or queried. A row of PCM cells is activated by a single word line WL and each one of the PCM cells in that row will affect the bitline BL to which it is electrically connected according to the state of the PCM cells, i.e. according to the PCM cells being in their high (amorphous) or low (crystalline) resistance state.

SUMMARY OF THE DISCLOSURE

Certain embodiments of the present disclosure generally relates to a method for a method for fabricating an electroplated electrical component, comprising: depositing an etch stop layer over a substrate; depositing alternating layers of conductive and insulator materials over said etch stop layer to create a vertical stack; etching a trench through the vertical stack to expose the etch stop layer; forming an electrical network to electrically connect to a portion of said conductive layers; electroplating on said conductive layers in said trench using a plating material based on a desired electrical behavior of the electrical component; forming an electrical connection on the plating material in said trench to allow for electrical connection through said trench to said plating material; and removing said electrical network connection to the conductive layers.

Certain embodiments of the present disclosure generally relates to a structure for a vertical electroplated electrical component, comprising: an etch stop layer disposed over a substrate; a vertical stack comprising alternating layers of conductive and insulator materials over the etch stop layer, wherein: the vertical stack has at least one trench formed there through, the conductive layers are electroplated using a plating material based on a desired electrical behavior of the electrical component to form on a sidewall of said trench, a shape of said plating material is hemispherical, a thickness of said plating material is less than a width of said trench, a thickness of said plating material is less than a thickness of adjacent insulating layers in said trench; and a top contact metallic layer formed on the sidewall of said trench wherein said plating material is between said conductive layer and said top contact layer and wherein said top contact layer is connected to other adjacent electroplated structures in said trench.

Certain embodiments of the present disclosure generally relate to an electrical system, comprising: a storage device comprising at least one vertical array, each vertical array comprising a plurality of memory cells; and a selector device to electrically access the plurality of memory cells in said storage device; a first metallic material to vertically connect said vertical array of memory cells; and a second metallic material to connected to an in-plane conductor material which is orthogonal to said vertical array of memory cells, and wherein the vertical array of memory cells comprise: an etch stop layer over a substrate; a vertical stack comprising alternating layers of in-plane insulator material and said in-plane conductor material over the etch stop layer, wherein: the in-plane conductor and insulator layers are parallel with a surface of the substrate, the vertical stack comprising at least one trench formed there through, and the conductor layers are electroplated using the plating material, wherein the plating material is based on a desired electrical behavior of an electrical component to form on the sidewall of said trench.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.

FIG. 1 is a block diagram of an example processing system.

FIG. 2A illustrates an example vertical stack of alternating layers of conductive and insulator materials, in accordance with certain embodiments of the present disclosure.

FIG. 2B illustrates two example vertical stacks of alternating layers of conductive and insulator materials, in accordance with certain embodiments of the present disclosure.

FIG. 2C illustrates the example vertical stacks of FIG. 2B with recessed layers of conductive material, in accordance with certain embodiments of the present disclosure.

FIG. 2D illustrates a perspective view of the example vertical stacks of FIG. 2C, in accordance with certain embodiments of the present disclosure.

FIG. 2E illustrates the example vertical stack of FIG. 2C with plating material coupled to each of the conductive layers, in accordance with certain embodiments of the present disclosure.

FIG. 2F illustrates a perspective view of the example vertical stack of FIG. 2E, in accordance with certain embodiments of the present disclosure.

FIG. 2G illustrates the example vertical stack of FIG. 2E with a contact layer connecting each of the plating materials, in accordance with certain embodiments of the present disclosure.

FIG. 2H illustrates a perspective view of the example vertical stack of FIG. 2G, in accordance with certain embodiments of the present disclosure.

FIG. 2I illustrates the example vertical stack of FIG. 2E where the conductive layers are not recessed, in accordance with certain embodiments of the present disclosure.

FIG. 2J illustrates the example vertical stack of FIG. 2G where the conductive layers are not recessed, in accordance with certain embodiments of the present disclosure.

FIG. 3 illustrates an example memory component using alternating layers of conductive and insulator materials, in accordance with certain embodiments of the present disclosure.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.

DETAILED DESCRIPTION

In the following, reference is made to embodiments of the disclosure. However, it should be understood that the disclosure is not limited to specific described embodiments. Instead, any combination of the following features and elements, whether related to different embodiments or not, is contemplated to implement and practice the disclosure. Furthermore, although embodiments of the disclosure may achieve advantages over other possible solutions and/or over the prior art, whether or not a particular advantage is achieved by a given embodiment is not limiting of the disclosure. Thus, the following aspects, features, embodiments and advantages are merely illustrative and are not considered elements or limitations of the appended claims except where explicitly recited in a claim(s). Likewise, reference to “the invention” shall not be construed as a generalization of any inventive subject matter disclosed herein and shall not be considered to be an element or limitation of the appended claims except where explicitly recited in a claim(s).

FIG. 1 is a block diagram of a processing system 100 having a processing device 102 and memory device 104. The memory device 104 comprises memory cells that are arranged in an array formation of rows and columns. The processor 102 interfaces with the array of memory cells via a row decoder 106 and column decoder 108. Individual memory cells are controlled by word lines that may extend along the rows of the array and bit lines that may extend along columns of the array. A memory cell may exist at a junction between the word and bit lines. During a read/write cycle, a row decoder selects a row page of memory cells to be read from or written to. Likewise, the column decoder selects a column address of memory cells for the read/write cycle. In certain embodiments of the present disclosure, each memory cell (e.g., at a junction between the word and bits lines) may include at least one of a phase change memory (PCM) cell (e.g., using phase change material) or ovonic threshold switch (OTS).

FIGS. 2A-2J illustrate a structure and method for manufacturing an electrical component (e.g., a memory device), according to certain embodiments of the present disclosure.

For example, the method may involve depositing an etch stop layer 202 over a substrate, on which a vertical stack of conductor and insulator layers may be deposited, as is illustrated in FIG. 2A. In certain embodiments, the etch stop layer 202 can be made of any material that does not etch in a fluorine containing plasma, such as chrome, magnetic metal, or an oxide that does not etch in fluorine such as aluminum oxide. Over the etch stop layer, alternating layers of insulator materials 204 and conductor materials 206 may be deposited to form a vertical stack. The vertical stack may comprise any number of insulator and conductor layers, in an alternating fashion as illustrated. In certain embodiments, the insulator material can be silicon dioxide (SiO₂) and the conductor material may be doped silicon, molybdenun (Mo), or tungsten (W). In certain embodiments, the thickness of the insulator conductor layers may be the same. In certain embodiments, the thickness 222 of the conductive layer may be less than the thickness 224 of the insulator layers.

In certain embodiments, a layer of hard mask 208 is deposited over the vertical stack and is used as an etch mask. The hard mask may be made of chrome, or any material that does not etch in a fluorine containing plasma, for example.

At this stage, one or more trenches may be formed within the vertical stack, as illustrated in FIG. 2B. For example, a masking layer may be deposited over the hard mask 208 in a pattern, leaving exposed portions of the hard mask layer where the one or more trenches are to be formed. Using an etch chemistry that will etch the exposed hard mask material, the exposed portion of the hard mask may be removed. At this stage, only portions of the vertical stack where a trench is to be formed are exposed, and other portions are covered by the hard mask material. Thus, using an etch chemistry that will etch the vertical stack materials, at least one trench 210A and 210B may be formed in vertical stack down to and exposing the etch stop layer. In certain embodiments, a reactive-ion etching (RIE) process may be used to form trenches 210A and 210B. Optionally, the hard mask 208 may be removed after the trenches are formed.

In certain embodiments, the conductive layers, now exposed to the side walls of each trench 210A and 210B, may be recessed from the insulator layers, as illustrated in FIG. 2C. That is, a horizontal length 226 of each of the layers of conductive materials 206 may be shorter than a horizontal length 228 of each of the layers of insulator materials 204. For example, the sidewalls of each trench 210A and 210B may be exposed to a plasma etch process that selectively etches the conductive layers faster than the insulator layers. Therefore, recessed pockets 212 may be formed where the conductor layers are recessed from the trench walls a greater distance than the insulator layers. The recessed pockets allow for plating material to be formed on each conductor layer (as discussed in more detail with respect to FIG. 2E) such that the plating material for each conductor layer does not come in contact with plating material formed on an adjacent conductor layer. In certain embodiments, a slow wet etch may be used to form the recessed pockets 212.

FIG. 2D illustrates a perspective view of the vertical stack of conductor layers 206 and insulator layers 204 comprising trenches 210A, 210B, 210C and 210D (collectively 210). In certain embodiments, each trench 210 may be a conical shape extending through the vertical stack of conductor and insulator materials and exposing the etch stop layer. In certain embodiments, each trench exposes a flat surface portion of the etch stop layer, as opposed to coming to a sharp point at the bottom of each trench.

As illustrated in FIG. 2E, the conductive layers may be plated using an electroplating process. Electroplating is a process that uses electric current to reduce dissolved metal cations so that they form a coherent metal coating on an electrode. To electroplate the conductive layers, the conductive layers of the vertical stack may be coupled to an electric network used to apply a voltage potential to the conductive layers, acting as the cathode during electrodeposition. The electrical network may be formed temporarily to electrically connect all the conductive layers that are to contain plating material. Each of the plating materials formed on the conductive layers may be an electroplated device (e.g., an electroplated phase change device). After the plating materials are formed, the electrical network may be removed to allow for addressable electroplated devices. Furthermore, the electrical resistance from the location on the substrate where the plating material is formed and the external power supply may be similar for all devices. The electrical resistance across this (temporary) electrical network is important prior to electroplating to ensure similar volume and composition of all the electroplated structures.

Depending on the parameters of electroplating, the plating material may have a hemispherical cross-section. Therefore, the thickest portion of the electroplated structure may be considered as the thickness of the electroplated structure for simplicity.

The thickness of the plating material may be less than the width of the trench to prevent adjacent plating material from joining Furthermore, the thickness of the insulation layers between the conductive layers is important to prevent adjacent electroplated devices from joining in the vertical direction. Therefore, the plating materials (e.g., electroplated devices) may have a thickness that is less than the thickness of the adjacent insulator layers. In the event the insulator layers are not equal, the thinner insulator layer may set the limit for the thickness of the electroplated device.

In certain embodiments, an aqueous bath electroplating process may be used to form the plating material. In other embodiments, an ionic solution may be used during the electroplating process. The material used for plating the conductive layers (e.g., material in the bath during electrodeposition) may be based on a desired electric behavior (e.g., a phase change material or ovonic threshold switch (OTS)), as discussed in more detail below. It should be noted that the hard mask layer may be removed or disconnected from any power supply such that no plating material is formed on top of the vertical stack. In certain embodiments, each plug may be formed to have similar size, thickness, and composition. After the plating material is formed, the conductive layers may be electrically isolated by disconnecting them from the electric network.

FIG. 2F is a perspective view of the vertical stack of FIG. 2E, in accordance with certain aspects of the present disclosure. As illustrates, each of the plugs 220 are formed around a circumference of trenches 210 and along an edge of the conductor layers 206.

As illustrated in FIG. 2G, each of the plugs 220 may be connected to a top contact strip 214, representing a diffusion barrier and ohmic connection to a via which may be formed in the trench (e.g., during a later processing step). The contact strip 214 may be made of a conductive material such as metal (e.g., tungsten, platinum or copper). In certain embodiments, the trench may be filled with conductive material after the contact strip 214 is formed. FIG. 2H is a perspective view of the vertical stack represented in FIG. 2G. As illustrated, the contact strip 214 may be formed via a conductive layer formed over each of the plating materials 220 and over the vertical stack.

In certain embodiments, the conductor layers 206 may not be recessed with respect to the insulator layers 204. For example, as illustrated in FIG. 2I, a horizontal length of the conductor layers 206 are the same as a horizontal length of the insulator layers 204. The plating materials 220 are formed on the conductive layers such that they do not make contact with plating material formed on of an adjacent conductive layer. FIG. 2J illustrates the vertical stack of FIG. 2I, with a contact strip 214 formed over each of the plugs 220.

FIG. 3 illustrates a plurality of memory cells in a memory device, in accordance with certain embodiments of the present disclosure. As illustrated, conductive layers of adjacent trenches may be connected to form one or more strips 218 of conductive material. The junction 216 between the conductive strip 218 and the contact strip 214 includes the plating material formed during the electroplating process, as described with respect to FIG. 2E.

As presented above, depending on the material used to plate the conductive layers, the junction 216 between the conductive layer and the contact strip 214 may have different electrical properties. For example, in certain embodiments, a material may be used such that the junction 216 has an electric property of a phase change material, such as GeSbTe, SeTe, SiTe, SbSe, SnSe, SnTe, SnSb, GeSb, GeTe, SiSb, and alloys thereof. An electrical behavior of phase change material is characterized by a shift from a blocking state (e.g., effectively an open circuit or highly resistive state) to a resistive state, based on whether a voltage applied to the phase change material reaches a certain threshold.

In other embodiments, a plating material may be used such that the junction 218 has an electric property of an ovonic threshold switch (OTS), such as GeSeBi. An OTS is a two terminal device that shifts from a blocking state (e.g., a high resistive state) to a conductive state based on whether a voltage applied to the OTS reaches a certain threshold.

Each strip 218 may be connected to one or more select devices (e.g., switches), configured to access the junctions 216 between each of the plurality of conductive layers and the contact strip 214. In certain embodiments, the conductive layer edges exposed to the sidewalls of each trench may be electroplated using phase change and/or OTS material to create one or more memory cell. Each memory cell may be controlled by components coupled with strip 218 and contact strip 214, which provide access to each of the junctions 216. That is, the plating material at the junctions 216 form memory cells of a vertical array, where each memory cell is selected via the strips 218 using the select devices. As illustrated, the conductive layers are orthogonal to the vertical array of memory cells.

The PCM and OTS devices disclosed herein are scalable 3D arrangements. It is to be understood that the description herein is not limited to PCM and OTS devices, but rather is applicable to any material with a desired electrical behavior. The embodiments disclosed herein are scalable, yet has a low footprint due to its 3D architecture.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. 

1-8. (canceled)
 9. A structure for a vertical electroplated electrical component, comprising: an etch stop layer disposed over a substrate; a vertical stack comprising alternating layers of conductor and insulator materials over the etch stop layer, wherein: the vertical stack has at least one trench formed there through, the conductor layers are electroplated using a plating material based on a desired electrical behavior of the electrical component to form on a sidewall of said trench, a shape of said plating material is hemispherical, a thickness of said plating material is less than a width of said trench, a thickness of said plating material is less than a thickness of adjacent insulator layers in said trench; and a top contact metallic layer formed on the sidewall of said trench wherein said plating material is between said conductor layer and said top contact layer and wherein said top contact layer is connected to other adjacent electroplated structures in said trench, wherein the top contact metallic layer comprises at least one of a phase change material or an ovonic threshold switch (OTS) material.
 10. The structure of claim 9, wherein the conductor layers are recessed from the sidewall of said trench. Page 2
 11. The structure of claim 10, wherein the conductor layers are recessed from the sidewall of the trench by a distance about equal to a thickness of the conductor layer.
 12. (canceled)
 13. The structure of claim 9, wherein the conductor material comprises doped silicon, Molybdenum (Mo) or Tungsten (W).
 14. The structure of claim 9, where said trench comprise a substantially vertical round hole. 15-20. (canceled) 